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1. product profile 1.1 general description ultrafast power diode in a sod59 (2-lead to-220ac) plastic package. 1.2 features and benefits ? fast switching ? guaranteed esd capability ? high thermal cycling performance ? low on-state loss ? low thermal resistance ? rugged: reverse voltage surge capability ? soft recovery minimizes power-consumin g oscillations 1.3 applications ? output rectifiers in high-frequency switched-mode power supplies 1.4 quick reference data BYW29E-200 ultrafast power diode rev. 5 ? 20 march 2012 product data sheet to-220ac table 1. quick reference data symbol parameter conditions min typ max unit v rrm repetitive peak reverse voltage - - 200 v i f(av) average forward current square-wave pulse; =0.5; t mb 128 c; see figure 1 ; see figure 2 --8a static characteristics v f forward voltage i f =8a; t j = 150 c; see figure 4 - 0.8 0.895 v dynamic characteristics t rr reverse recovery time i f =1a; v r =30v; di f /dt = 100 a/s; t j = 25 c; ramp recovery; see figure 5 ; see figure 7 - 2025ns electrostatic discharge v esd electrostatic discharge voltage hbm; c=250pf; r=1.5k ? --8kv
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 2 of 11 nxp semiconductors BYW29E-200 ultrafast power diode 2. pinning information 3. ordering information 4. limiting values table 2. pinning information pin symbol description simplified outline graphic symbol 1 k cathode sod59 (to-220ac) 2 a anode mb mb mounting base; cathode mb 12 a 001aaa020 k table 3. ordering information type number package name description version BYW29E-200 to-220ac plastic single-ended pa ckage; heatsink mounted; 1 mounting hole; 2-lead to-220ac sod59 table 4. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v rrm repetitive peak reverse voltage - 200 v v rwm crest working reverse voltage - 200 v v r reverse voltage - 200 v i f(av) average forward current square-wave pulse; =0.5; t mb 128 c; see figure 1 ; see figure 2 -8a i frm repetitive peak forward current square-wave pulse; = 0.5 ; t p = 25 s; t mb 128 c -16a i fsm non-repetitive peak forward current t p = 8.3 ms; sine-wave pulse; t j(init) =25c - 88 a t p = 10 ms; sine-wave pulse; t j(init) =25c - 80 a i rrm repetitive peak reverse current = 0.001 ; t p =2s - 0.2 a i rsm non-repetitive peak reverse current t p = 100 s - 0.2 a t stg storage temperature -40 150 c t j junction temperature - 150 c electrostatic discharge v esd electrostatic discharge voltage hbm; c = 250 pf; r = 1.5 k ? -8kv
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 3 of 11 nxp semiconductors BYW29E-200 ultrafast power diode fig 1. forward power dissipation as a function of average forward current; square waveform; maximum values fig 2. forward power dissipation as a function of average forward current; sinusoidal waveform; maximum values 003aaj507 i f(av) (a) 012 8 4 4 8 12 p tot (w) 0 = 1 0.5 0.2 0.1 i f(av) (a) 08 6 24 003aaj508 4 2 6 8 p tot (w) 0 a = 1.57 1.9 2.2 2.8 4.0
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 4 of 11 nxp semiconductors BYW29E-200 ultrafast power diode 5. thermal characteristics table 5. thermal characteristics symbol parameter conditions min typ max unit r th(j-mb) thermal resistance from junction to mounting base see figure 3 --2.7k/w r th(j-a) thermal resistance from junction to ambient in free air - 60 - k/w fig 3. transient thermal impedance from junction to mounting base as a function of pulse width 003aaj513 10 -1 10 -2 1 10 z th(j-mb) (k/w) 10 -3 t p (s) 10 -6 1 10 10 -1 10 -2 10 -5 10 -3 10 -4 t p t p t p t t =
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 5 of 11 nxp semiconductors BYW29E-200 ultrafast power diode 6. characteristics table 6. characteristics symbol parameter conditions min typ max unit static characteristics v f forward voltage i f =8a; t j =25c; see figure 4 - 0.92 1.05 v i f =20a; t j =25c; see figure 4 -1.11.3v i f =8a; t j = 150 c; see figure 4 - 0.8 0.895 v i r reverse current v r = 200 v; t j =25c - 2 10 a v r = 200 v; t j = 100 c - 0.2 0.6 ma dynamic characteristics q r recovered charge i f =2a; v r =30v; di f /dt = 20 a/s; t j = 25 c; see figure 5 ; see figure 6 -411nc t rr reverse recovery time i f =1a; v r =30v; di f /dt = 100 a/s; ramp recovery; t j =25c; see figure 5 ; see figure 7 - 2025ns i f = 0.5 a; i r = 1 a; step recovery; i r(meas) =0.25a; t j =25c; see figure 8 - 1520ns v frm forward recovery voltage i f =1a; di f /dt = 10 a/s; t j =25c; see figure 9 -1-v fig 4. forward current as a function of forward voltage fig 5. reverse recovery definitions; ramp recovery v f (v) 02 1.5 0.5 1 003aaj509 10 20 30 i f (a) 0 (1) (2) (3) 003aa562 t rr tm 100 25 i f d f dt i i q r
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 6 of 11 nxp semiconductors BYW29E-200 ultrafast power diode fig 6. recovered charge as a function of rate of change of forward current; maximum values fig 7. reverse recovery time as a function of rate of change of forward current; maximum values fig 8. reverse recovery definitions; step recovery fig 9. forward recovery definitions 003aaj510 10 2 10 10 3 q r (nc) 1 di f /dt (a/s) 110 2 10 (1) (2) (3) (4) 003aaj511 10 2 10 10 3 t rr (ns) 1 di f /dt (a/s) 110 2 10 (1) (2) 003aa563 t rr tm 0.25 i i f i i q r i f 001aab912 tm tm v f v f i f v f
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 7 of 11 nxp semiconductors BYW29E-200 ultrafast power diode 7. package outline fig 10. package outline sod59 (to-220ac) references outline version european projection issue date iec jedec jeita sod59 2-lead to-220ac sod059_po 09-08-17 09-08-25 unit mm max nom min 4.7 4.3 1.40 1.15 1.7 1.3 0.65 0.45 15.8 15.6 6.8 6.4 5.08 (ref) 16.25 15.70 3.7 3.5 a dimensions note 1. protruded dambar are included in the dimension. plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead to-220ac sod59 a 1 b 0.95 0.70 b 1 (1) cdd 1 e 10.30 9.65 ehl 15.0 12.5 pq 2.6 2.2 q 2.9 2.7 0 5 10 mm scale c a 1 a q e q h b 1 b 2 1 d 1 d p e l
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 8 of 11 nxp semiconductors BYW29E-200 ultrafast power diode 8. revision history table 7. revision history document id release date data sheet status change notice supersedes BYW29E-200 v.5 20120320 product data sheet - byw29e_series v.4 modifications: ? the format of this document has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. byw29e_series v.4 20010801 product data sheet - byw29e_series v.3
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 9 of 11 nxp semiconductors BYW29E-200 ultrafast power diode 9. legal information 9.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple de vices. the latest product status information is available on the internet at urlhttp://www.nxp.com . 9.2 definitions preview ? the document is a preview version only. the document is still subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any re presentations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 9.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and r eplaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. document status [1] [2] product status [3] definition objective [short] data sheet development this document contai ns data from the objective spec ification for product developmen t. preliminary [short] data sheet qua lification this document contains data from the preliminary specification. product [short] data sheet production this doc ument contains the pr oduct specification.
BYW29E-200 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 5 ? 20 march 2012 10 of 11 nxp semiconductors BYW29E-200 ultrafast power diode terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms an d conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulati ons. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 9.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey, g reenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode ? are trademarks of nxp b.v. hd radio and hd radio logo ? are trademarks of ibiquity digital corporation. 10. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BYW29E-200 ultrafast power diode ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 20 march 2012 document identifier: BYW29E-200 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 11. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 general description . . . . . . . . . . . . . . . . . . . . . .1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 thermal characteristics . . . . . . . . . . . . . . . . . . .4 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 7 package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7 8 revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8 9 legal information. . . . . . . . . . . . . . . . . . . . . . . . .9 9.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9 9.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 9.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 9.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10 10 contact information. . . . . . . . . . . . . . . . . . . . . .10

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